General information
Type CPU / Microprocessor
Market segment Desktop
Family ph II X2
Model number ? 550
CPU part numbers HDX550WFK2DGM is an OEM/tray microprocessor
HDX550WFGMBOX is a boxed microprocessor with fan and heatsink
Stepping code CACAC AC
Frequency ? 3100 MHz
Bus speed ? 667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier ? 15.5
Package 938-pin organic micro-PGA
Sockets Socket AM2+
Socket AM3
Weight 1.3oz / 38.2g (CPU)
12.3oz / 349.8g (Box)
Fan/heatsink PBT-GF30-FR
Introduction date Nov 4, 2009
Architecture / Microarchitecture
Microarchitecture K10
Platform Dragon
Processor c ? Callisto
c stepping ? RB-C3
CPUID 100F43
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Die size 258mm2
Data width 64 bit
The number of CPU cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size ? 2 x 512 KB 16-way set associative exclusive caches
Level 3 cache size Shared 6 MB 48-way set associative cache
Cache latency [1] 3 (L1 cache)
15 (L2 cache)
53 (L3 cache)
Multiprocessing Uniprocessor
Features MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
Low power features Cool'n'Quiet 3.0
CoolCore Technology ?
Dual Dynamic Power Management ?
c C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 21.3
Other peripherals HyperTransport 3 technology
Electrical / Thermal parameters
V c ? 0.875V - 1.4V
Maximum operating temperature ? 55°C - 70°C
Thermal Design Power ? 80 Watt