ce G3900 specifications
The specs can be used for short-term
listings on auction and classifieds sites
General information
Type CPU / Microprocessor
Market segment Desktop
Family I ce Dual-Core
Model number ? G3900
CPU part numbers CM8066201928610 is an OEM/tray microprocessor
BX80662G3900 is a boxed processor with fan and heatsink (English version)
BXC80662G3900 is a boxed processor with fan and heatsink (Chinese version)
Frequency ? 2800 MHz
Bus speed ? 8 GT/s
Clock multiplier ? 28
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
S-spec numbers
Part number ES/QS processors Production processors
QJZU SR2HV
BX80662G3900 +
BXC80662G3900 +
CM8066201928610 +
Unknown +
Architecture / Microarchitecture
Microarchitecture Skylake
Processor c ? Skylake-S
c stepping ? S0 (QJZU, SR2HV)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ? 2 x 256 KB 4-way set associative caches
Level 3 cache size 2 MB 8-way set associative shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
SGX / Software Guard Extensions
Low power features Enhanced / technology ?
Integrated peripherals / components
Display controller 3 displays
Integrated graphics GPU Type: HD 510
Graphics tier: GT1
Microarchitecture: Gen 9
Execution units: 12
Base frequency (MHz): 350
Maximum frequency (MHz): 950
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Thermal Design Power ? 51 Watt
Notes on I ce G3900