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Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia Thermal Grizzly Minus Pad High Compression - 120x100x3.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics in Saudi Arabia

Thermal Grizzly Minus Pad High Compression - 120x100x1.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics

SAR 105
SAR 120
Category
Fans & Cooling
Weight
95 g
Size120x100x1.0mm (2 Pack)
Capacity120x100x1.0mm (2 Pack)
– 1 +

Special Features

  • ULTRA-HIGH COMPRESSION: Adapts seamlessly to varying component heights, ensuring optimal thermal contact across diverse hardware surfaces.
  • VERSATILE APPLICATION: Ideal for GPUs, VRAM, VRMs, SSDs, and notebooks, accommodating multiple components with a single pad thickness.
  • ELECTRICALLY INSULATING: Provides safe usage on sensitive electronics, preventing short circuits and ensuring component protection.
  • HIGH THERMAL CONDUCTIVITY: Delivers efficient heat transfer, maintaining optimal operating temperatures for high-performance components.
  • SINGLE THICKNESS SOLUTION: Eliminates the need for multiple pad sizes, simplifying installation and reducing inventory requirements.

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