Product InformationAlphacool's double-sided adhesive core thermal pad can be used to cool electronic components of all kinds where it is important to effectively dissipate waste heat.This significantly improves the performance and durability of the components.The assembly is significantly simplified by the material-related stickiness.Flexible and powerfulThe thermal pad is reliable and powerful due to its material composition.With its low thickness, it offers a wide range of possible applications.It can be flexibly tailored to meet individual needs.Due to the adhesive nature, an effortless assembly of electrical components such as DDR modules, motherboard components or power supplies is possible.Technical specificationsDimensions (L x W x H)100x100x0.25mmThermal Conductivity (ASTM D5470)1 W/mK ±10%Thickness (ASTM D374)0.25mmstructurefiberglass fabricContinuous operating temperature-30~+120℃Short-term operation temperature (30 seconds)180℃Density (ASTM D792)1.2 g/ccHolding Force (PSTC-7)>3000 minutes180° peel adhesion (aluminum) (PSTC-101)>16N / 25mmdielectric breakdown voltage3KV ±10%Thermal Impedance @10psi (ASTM D5470)1.26 C-in² / WThermal Impedance @30psi (ASTM D5470)1.06 C-in² / WThermal Impedance @50psi (ASTM D5470)1.05 C-in² / WColorwhiteRelated LinksData sheet (DE)Data sheetsafety data sheetSafety data sheet(1)Safety data sheet(2)