IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife for Mobile Phone Repair (Removing The CPU and Removing Glue 5-Piece Set) Removing the CPU and removing glue 5-piece set
مقاس إزالة وحدة المعالجة المركزية وإزالة الغراء مجموعة مكونة من 5 قطع
مميزات خاصة
is , not easy to deform when bent, and sturdy.
The professional repair tool set is suitable for mobile phone CPU disassemble and repair.
of applications, support motherboard repair, hardware repair, instrument repair.
Comfortable hand feel, humanized design, double‑headed SK5 blade, used to separate solder joints.
Used for BGA repair, disassembling mobile phone CPU chip and mobile phone repair.
وصف
Specification:
Item Type: CPU Tool
Blade Material: SK5 Steel
Color: As Picture Shown
Weight: Approx. 60.0g/2.1oz
Product Model: TE-018
Function: Chip removal, cleaning gluescratch padmotherboard parts installation and removal
Function: Disassemble mobile phone IC chip
Application: CPU glue removal tool
packing list:
10 x CPU Tool
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