مميزات خاصة

【Thermal Conductivity】CPU Thermal Paste and Thermal Silicone Grease provide conductivity above 0.671 W per m K for heat dissipation around electronics heat sinks and LEDs.
【Heat Resistants Bonding】Thermal Compound uses one component room temperature vulcanized silicone with insulation and heat resistance up to 572 F for direct component bonding.
【Fast Surface Cure】The silicone adhesive has a surface thinning time of 10 minutes at 25 C, with strong bonding and a solvent free formula for electronics assembly.
【25g Multi Tube Set】Includes 5 tubes of white silicone grease, 5g each, providing a total 25g supply for repeated application and extended storage.
【Versatile Applications】Suitable for flexible bonding, heat dissipation, insulation and encapsulation in 3D printers, electronics, electrical appliances, instruments, LEDs and heat sinks.

وصف

Specification:
Item Type: CPU Thermal Paste
Material: Silicone
Volume: 25g (5 x 5g)
Product Shape: White paste
Thermal Conductivity: >0.671W/m.k
Tear Strength: 1.5MPA
Surface Thinning Time: 10min/25℃

How to Use:
Use method:
1. When using the product directly extruded, wipe with the surface of the object to be stuck, immediately after use, cover for another trial.
2. Surface curing speed and the relative humidity and temperature in the air, the higher the temperature, the curing speed, and conversely, the slower.
3. Recommended coating thickness: 0.1‑0.5mm, the thicker the better.
4. Please use solvent to clean the surface of the object to be stuck before use (such as alcohol), do not clean with detergent, and only after the surface is clean can be applied.

Package List:
5 x CPU Thermal Paste

مرحبًا،

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شحم سيليكون حراري، معجون حراري لوحدة المعالجة المركزية بدرجة 572 فهرنهايت مقاوم للحرارة

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