Instructions for Use:
1. Clean the circuit board, ensuring the surface is free of debris, dust, and grease.
2. Shake well before use.
3. Black / White Version: Mix component A and component B at a weight ratio of 1:5 (not a volume ratio), stir thoroughly before use (weighing with an electronic scale is required).
Clear Version: Mix component A and component B at a weight ratio of 1:2 (not a volume ratio), stir thoroughly before use (weighing with an electronic scale is required).
4. After mixing, pour the adhesive onto the circuit board surface. Allow it to cure naturally, allowing air bubbles to dissipate. Initial curing takes 2 hours, and complete curing takes 6 hours.

Notice:
1. Shake well before use.
2. Weigh using an electronic scale.
3. Mix black and white versions at a 1:5 weight ratio and stir thoroughly before use.
4. Mix transparent versions at a 1:2 weight ratio and stir thoroughly before use.
5. Initial curing takes 2 hours; complete curing takes 6 hours.