[Efficient Reballing Solution] Designed to streamline your bga repair workflow these stencils make reballing ic chips quick and effortless. the precise openings ensure perfect solder ball alignment while the sturdy frame provides stability during the solder paste application process saving you time and improving work efficiency.
[Thermal Efficiency Design] Our stencils feature a special plump design that effectively prevents heat dissipation during the soldering process. this innovative construction maintains consistent temperature distribution across the chip area resulting in more reliable solder connections and reduced of cold solder joints.
[Premium Stainless Steel Construction] Crafted from stainless steel plate with optimal thickness these stencils offer exceptional durability and precise solder ball placement. the robust material ensures long lasting performance even with frequent use while maintaining perfect tension for consistent reballing results every time.
[Comprehensive Chip Compatibility] Specifically engineered for bga153 162 169 186 221 254 and emmc chips these professional stencils cover the most common bga chip sizes in electronics repair. the package includes one stencil that serves all your reballing needs making it an economical must have for repair technicians.
[Versatile 6 in 1 Design] This universal bga stencil set features a clever 6 in 1 design that accommodates multiple chip sizes including bga153 162 169 186 221 254 and emmc chips. the multifunctional design saves you money and storage space while providing all sizes for professional chip reballing and repair work.

Spec:

Features: 1.6 in 1 design, which can implant a plurality of chips.
2.These stencils were made of stainless steel plate, the thickness of steel mesh is appropriate.
3.It adopted the special plump design which can avoid Heat dissipation.
4.It is easy and fast for reballing the BGA IC, useful and economical accessories