33pcs BGA reballing stencils universal template kit designed for laptop and desktop motherboard north-south bridge repair. These stainless steel stencils withstand direct heat application without deformation. The kit includes multiple solder ball sizes to accommodate various BGA chip specifications.
Suitable technicians performing precision reballing work, these stencils feature etched size markings for quick identification. The 304 stainless steel construction ensures durability through repeated heating cycles. Compatible with standard hot air rework stations.
Package contains:
2pcs for 0.35mm solder ball
1pcs for 0.4mm solder ball
14pcs for 0.5mm solder ball
13pcs for 0.6mm solder ball
3pcs for 0.76mm solder ball
Important Notes:
Actual color may vary slightly due to monitor settings.
Manual measurement may have 1-2mm tolerance.
Metric to imperial conversion: 1cm = 0.39 inches.
This professional BGA rework kit provides essential templates for motherboard repair specialists working with graphics cards and communication boards. The organized size selection simplifies chip-specific reballing procedures while maintains structural integrity during thermal applications.