[High Precision BGA Repair] 27-piece stainless steel stencil set for accurate BGA chip reballing with multiple spacing options from 0.25mm to 1.0mm.
[Universal Compatibility] Suitable for various BGA chips used in laptops desktops and game consoles with 0.65mm 0.5mm 0.45mm and other common spacing sizes.
[Direct Heating Design] Stainless steel material allows direct heat application during reballing process for efficient solder ball placement.
[Multiple Size Options] Includes 27 templates covering 24x24 to 41x41 grid sizes for different BGA chip .
[Durable Construction] Made of quality stainless steel for repeated use in professional BGA rework and repair scenarios.

Condition: 100% Brand New
Item Type: For BGA Universal Stencils
Material: Stainless Steel
Color: As Pictures Shown
Quantity: 27Pcs/Set
Application: For BGA Chips Reballing
Stencils Size:
0.65mm Spacing 1.0mm
0.5mm Spacing 0.8mm
0.45mm Spacing 0.78mm
0.4mm Spacing 0.78mm
0.6mm Spacing 1.0mm
0.6mm Spacing 0.9mm
0.6mm Spacing 1.1mm
0.76mm Spacing 1.27mm
0.55mm Spacing 1.02mm
0.5mm 35 x 35 Spacing 0.78 mm
0.5mm 40 x 40 Spacing 0.8mm
0.76mm 30 x 30
0.6mm 24 x 24
0.6mm 27 x 27
0.3mm Spacing 0.58mm
0.35mm Spacing 0.65mm
0.35mm Spacing 0.6mm
0.3mm Spacing 0.5mm
0.25mm Spacing 0.5mm
0.76mm 34 x 34
0.76mm 37 x 37 Spacing 1.27mm
0.76mm 41 x 41 Spacing 1.27mm
1.0mm Spacing 1.5mm
0.6mm 30 x 30
0.6mm 33 x 33
0.76mm 33 x 33 Spacing 1.27mm
0.6mm 41x41
27
Pcs/Set x For BGA Universal Stencils