Size:0.24"×0.24"×0.12"inch.
Material: High-Purity Copper.
This ultra-thin heatsink is engineered to manage heat in compact, high-performance electronics:
For Computers: Aids in reducing heat buildup for M.2 NVMe/SATA SSDs during extended workloads such as gaming or content creation.
For Gaming Consoles: Helps improve thermal dissipation for the internal SSD in modern consoles following a storage capacity upgrade.
For Additional Components: Can be applied as a supplementary cooler for various chips, including GPU VRAM and other integrated circuits on motherboards or expansion cards.
During intensive operations, high temperatures can cause components like SSDs to reduce speed, a mechanism known as thermal throttling. This cooling kit is designed to address this:
Heat Reduction: The copper base efficiently absorbs heat, and the graphene coating aids in spreading it. This process can help lower operating temperatures to support consistent performance.
Thermal Management: Maintaining a cooler operating environment is beneficial for the sustained operation of electronic components.
Note: All references to device types are for descriptive purposes of potential application scenarios only.