WIDE COMPATIBILITY: The wide working temperature range (-40℃-180℃) of the 100g Thermal Putty & its Insulation properties make it suitable for all electronic components in need of heat dissipation, such as CPUs, GPUs, processors, SSDs, PCBs, RAM, VRAM, graphics card and PS4/PS5 consoles.
18W/mK THERMAL CONDUCTIVITY: FEHONDA Thermal Putty GPU formulated with high-content premium high thermal conductivity fillers, helps solve CPU thermal throttling and maintain the PC's full-load stability. Its excellent fluidity ensures filling the tight gap for seamless heat conduction.
EASY APPLICATION: It is easy to apply with a spatula or a finger sleeve. Its ideal viscosity ensures it spreads smoothly and evenly for a consistent layer across the surface. Recommend using latex gloves to shape the paste into balls or discs and then apply them where needed.
STABLE HEAT DISSIPATION: The Thermal Putty Laptop's low-volatility silicone oil formulation resists oil-powder separation and evaporation, as demonstrated by a 1000+ hour thermal shock test with no drying, no cracking, and no sagging. Ensuring long-term stable heat dissipation.
FEHONDA BRAND ASSURANCE – 19 years of dedication to thermal putty technology, trusted by top enterprises like BYD, DJI, and Huawei. Certified as a National High-Tech Enterprise, adhering to strict quality standards. Giving you peace of mind for industrial and electronic applications.
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