HIGH THERMAL CONDUCTIVITY: 120*120mm thermal pad cpu formulated with high-content premium high thermal conductivity fillers. It is ultra-soft and molds perfectly to the contact surface; the excellent compressibility ensures filling the tight gap for effectively lowering temperature in seconds.
WIDE COMPATIBILITY: The wide working temperature range (-40℃-180℃) of the cpu thermal pad makes it suitable for all electronic components in need of heat dissipation. and FEHONDA is available in different thicknesses of 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm to meet different needs.
EFFORTLESS APPLICATION: Our ssd thermal pad can be easily cut to any size and removed with zero residue. As demonstrated by a dielectric strength test, it is not easy to puncture or tear under pressure. Double-sided self-adhesive for easy assembly: peel off the protective film, apply, and over.
SUPER RELIABLE & DURABLE: The gpu thermal pads are insulated, flame-retardant, anti-static, and non-corrosive properties. After 2000+ hours of high-temperature aging testing, the nvme thermal pad's surface remains smooth with no cracking or chalking, proving its long-term stable heat dissipation.
FEHONDA BRAND ASSURANCE – 19 years of dedication to thermal pad ssd technology, trusted by top enterprises like BYD, DJI, and Huawei. Certified as a National High-Tech Enterprise, adhering to strict quality standards. Giving you peace of mind for industrial and electronic applications.
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