Gelid Solutions GN-Ultimate 4W Thermal Putty 30 g. Non-Electric - Density (g/cm): 3.3 - Temperature C: -30 to 200C - High Thermal Conductivity - Compatible with Apple, Intel, AMD, Nvidia
EXCEPTIONAL DISSIPATION PERFORMANCE - Professional Thermal Putty - The GN-Ultimate Thermal Putty offers very high thermal conductivity for fast heat transfer from CPU, GPU, VRM, motherboards, power modules and high power LEDs. Its soft, low-pressure formula ensures superior cooling than traditional silicone thermal pads, ideal for gaming PCs, notebooks and advanced cooling systems.
SAFE AND NON-ELECTRICAL CONDUCTIVE - Advanced Thermal Conductive Material - This thermal compound is 100% non-electrically conductive, preventing short circuits. Perfect as a thermal interface for heatsink, processor and graphics cards, evenly fills the gaps between multiple chips and shared heatsinks ensuring low thermal resistance and an ultra-thin layer under pressure.
NON-HARDENING & OIL LEAK-FREE FORMULA - LONG LASTING - Maintains stable and reliable performance over time without drying out, cracking or releasing oil. GN-Ultimate stays soft and effective in a wide temperature range from -30°C to 200°C, ideal for gaming PCs, high-performance laptops, consoles, LEDs and industrial devices.
Easy application and perfect fit – Thermal paste for CPU/GPU – easy to apply and naturally adhesive, this heat conductive paste adapts to uneven surfaces for maximum contact and minimum resistance. The high compressive capacity ensures a perfect seal without mess, remaining stable even in the presence of vibration or thermal expansion, ideal for modding and custom systems.
RELIABLE AND ROHS Compliant - High Quality Thermal Interface - Designed to meet the most stringent environmental and safety standards, GN-Ultimate Thermal Putty is RoHS compliant and ensures consistent thermal management and professional cooling performance, perfect for hardware technicians, assemblers and PC enthusiasts.
Description
State-of-the-art thermal paste Maximum thermal conductivity Electrically non-conductive Does not polymerize and does not ooze Strong moldability Gelid Ultimate thermal paste is designed to provide perfect thermal contact with the heat sink when installed on PCBs with height differences and uneven surfaces, such as microcontroller unit, memory ICs, analog ICs, MOSFETs and other SMD components. GN-Ultimate Thermal Paste is a versatile material for filling gaps, offering low thermal resistance and ultra-thin effect under pressure, ideal for multiple chips sharing a heatsink.
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