TH-3019 Solder Paste, Sn99/Ag0.3/Cu0.7 High Temperature Solder Paste, 217℃ Melting Point, No Clean Lead Free Soldering Paste, Solder Paste for Electronics (5MLx4Pack)
Special Features
Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7% / Flux11.2%.
High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.
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