Search

Home / TANG HONG / Welding & Soldering
TH-3019 Solder Paste, Sn99/Ag0.3/Cu0.7 High Temperature Solder Paste, 217℃ Melting Point, No Clean Lead Free Soldering Paste, Solder Paste for Electronics (5MLx4Pack) in Saudi Arabia

TH-3019 Solder Paste, Sn99/Ag0.3/Cu0.7 High Temperature Solder Paste, 217℃ Melting Point, No Clean Lead Free Soldering Paste, Solder Paste for Electronics (5MLx4Pack)

SAR 100

Brand
TANG HONG
Weight
50 g
StyleSolder Paste-64g
1 +

Special Features

  • Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7% / Flux11.2%.
  • High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
  • Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
  • Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
  • Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
  • Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.

Related Items


{"error":"Error","cart_limit":"You have too many items in your cart.","prod_limit":"You cannot add any more of this item"}