LSM6DS3 High Motion Sensors Module for Wearables and Embedded Systems with Temperature Compensation and FIFO

Features:
The LSM6DS3 accelerometer and gyroscope module delivers motion sensing with ±16g acceleration ranges, ±2000°/s angular velocities detection, and digital temperature for embedded systems requiring SPI/I2C communication and 8KB FIFO buffer optimization.
2 axises motion tracking, configurable measurement ranges, and low power consumption modes, this sensors module combines accelerometer, gyroscope, and temperature sensors in a space saving PCB for seamless microcontroller integration.
for iots developers, robotics engineers, and wearable creators needing motion data acquisition in applications like fitness trackers, and industrial automation systems.
for real time orientation detection in headsets, vibrations analysis in smart machinery, and energy efficient activity in battery powered remote sensors operating under variable environmental.
With its advanced FIFO data management reducing processor load by multiple ranges calibration, this LSM6DS3 module ensures uninterrupted in high speed rotational scenarios while maintaining
Specifications:
Materials: PCB
Supply Voltages: 1.71V-5V
Output Interfaces: SPI IIC Interfaces
Product Size: 18x13mm/7.08x5.11inch
Quantity: 1PC, 3Pcs(optional)

Package Includes:
1/3Pcs LSM6DS3 Accelerometer Gyroscope sensors Module

Note:
Please allow 0-1cm error due to manual measurement. make sure you not mind before bid.
Due to the differences between different monitors, the Pictures may not reflect the actual of the item.