Description: Heat curing epoxy chip bonding adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Low Viscosity. Designed to be dot/line dispensed. Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose. Curing Time: 120-180 seconds at 190+ Celsius (374+ F). Recommended Curing Temperature: 190 to 260C (374 to 500F). Maximum Curing Temperature: 260C (500F). Designed to cure at leaded (Sn63/Pb37) and lead free (SAC305) reflow temperatures. Maximum recommended dot size: 10mm x 10mm x 1mm (100mm^3). Specifications (After Curing): Operating Temperature Range: -40 to 125C (-40 to 257F) (After Curing, After Reflow). Density: 1.4g/cc. Viscosity (Malcom @ 5 RPM, 25C): 44 Pa-s (44,000 mPa-s). Size: 30g/30cc syringe. Shelf Life: Refrigerated >24 months, unrefrigerated >24 months. Stencil Life: >12 hours @ 20-50% RH 22-28C (72-82F). >8 hours @ 50-70% RH 22-28C (72-82F). Cleaning: Clean using isopropyl alcohol (IPA). Storage and Handling: Store at 3-25C (37-77F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25C (68-77F) before use. Transportation: This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.