Release surface in fabrication of parts cured at elevated temperatures.
Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
Country of origin: United States
Description
3M Polyimide Film Tape 5413 with DuPont Kapton polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications. Amber, 2.7 mil thick.