1. [EFFICIENT REBALLING] Streamlines the BGA IC reballing process, making it quick and hassle-free for users.
2. [PRECISION ENGINEERING] Carefully crafted design with optimal thickness, ensuring consistent and accurate soldering results.
3. [USER-FRIENDLY DESIGN] Easy to handle and operate, making it suitable for both beginners and experienced soldering technicians.
4. [ENHANCED PERFORMANCE] Improves heat dissipation during soldering, preventing overheating and ensuring stable solder connections.
5. [CUSTOMIZED FOR BGA] Tailored for BGA153/162/169/186/221/254/EMMC chips, guaranteeing a perfect fit and reliable reballing experience.

Specification:
Features: 1.6 in 1 design, which can implant a plurality of chips.
2.These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate.
3.It adopted the special plump design which can avoid Heat dissipation.
4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.
5. It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.

Specifications:
Material: High Quality Stainless Steel
Weight: Approx. 6g
Compatible with: BGA162, BGA153, BGA169, BGA221, BGA186, BGA297, BGA254, BGA178, BGA200, BGA110, BGA60, BGA70

Package Included:
1 x BGA stencils

Note:
1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.