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OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG in Saudi Arabia OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG in Saudi Arabia OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG in Saudi Arabia OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG in Saudi Arabia OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG in Saudi Arabia

OTS-8(16)-1.27-03 Pitch 1.27mm Width 3.9mm for SOP8/SO8/SOIC8 Package IC MCU Test Burn-in Programming Adapter Socket Enplas @XYG

SAR 136
Brand
XYG-Socket
Weight
18 g
– 1 +

Special Features

  • Type: Open Top
  • Manufacturer：Enplas

Description

Enplas IC Test & Burn-in Socket, for SOP8/SO8/SOIC8 package

Features
High quality and durable
Tested before shipping
Easy to use

Applicable Devices
Package:
SOP8
SO8
SOIC8
Pitch: 1.27mm
Width: 3.9mm

Socket PN
OTS-8(16)-1.27-03

Download
Socket Datasheet(contact me via Amazon message if you need)

Package Contains:
OTS-8(16)-1.27-03 Socket × 1

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