ce G4900 specifications
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
CPU part numbers
CM8068403378112 is an OEM/tray microprocessor
BX80684G4900 is a boxed processor (English version)
BXC80684G4900 is a boxed processor (Chinese version)
Frequency ?
3100 MHz
Low power frequency
800 MHz
Clock multiplier ?
31
Socket 1151 / H4 / LGA1151
S-spec numbers
Architecture / Microarchitecture
Microarchitecture
Coffee Lake
Processor c ?
Coffee Lake-S
c stepping ?
B0 (QP9G, SR3W4)
Manufacturing process
0.014 micron
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ?
2 x 256 KB 4-way set associative caches
Level 3 cache size
2 MB 8-way set associative shared cache
Physical memory
64 GB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
Security Features
NX / XD / Execute disable bit ?
MPX / Memory Protection Extensions
SGX / Software Guard Extensions
SMAP / Supervisor Mode Access
SMEP / Secure Mode Execution
Low power features
c C1/C1E, C3, C6, C7, C8, C9 and C10 states
Package C2, C3, C6, C7, C8, C9 and C10 states
Enhanced / technology ?
Integrated peripherals / components
Display controller
3 displays
DVI / DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics
Graphics tier: GT1
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
ECC supported: Yes
Other peripherals
Direct Media Interface 3.0 (4 lanes)
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Minimum/Maximum operating temperature ?
0°C (case temperature) - 65.6°C (case temperature) [1]
100°C (Digital Thermal Sensor)
Thermal Design Power ?
54 Watt
Notes on ce G4900
Package C10 low power state is not supported on 200 series chipsets Optane memory is supported
The processor has the following security, data protection and/or software features: Secure Key, Identity Protection technology, OS Guard and Boot Guard.
The CPU is compatible with DirectX 12, OpenGL 4.5, OpenCL 1.2, OpenCL 2.0 and OpenCL 2.1 APIs.
The graphics unit has the following software features enabled: Quick Sync Video, Clear Video technology, Clear Video HD technology and InTru 3D technology.