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Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction in Saudi Arabia

Dioche AdjustableBGA Reballing Station HT-90 Universal Diagonal Stencil Solder Kit for CPU and Mobile Phone BGA Manual Rework - Durable Aluminum Alloy Construction

SAR 143
Brand
Dioche
Weight
372 g
– 1 +

Special Features

  • adjustable bga bga reball bga rework station reballing stencil jig holder1. Premium Material and Design: This BGA Reballing Station is constructed from aluminum alloy, making it both lightweight and durable. Its unique diagonal design enhances stability, allowing for precise and effective ball planting on BGA chips ranging from 9mm to 43mm.
  • adjustable bga bga reball bga rework station reballing stencil jig holder1. Premium Material and Design: This BGA Reballing Station is constructed from aluminum alloy, making it both lightweight and durable. Its unique diagonal design enhances stability, allowing for precise and effective ball planting on BGA chips ranging from 9mm to 43mm. 2. Enhanced Functionality: The HT-90 features an adjustable chip size knob and diversion groove, facilitating easy and efficient pouring of
  • adjustable bga bga reball bga rework station reballing stencil jig holder1. Premium Material and Design: This BGA Reballing Station is constructed from aluminum alloy, making it both lightweight and durable. Its unique diagonal design enhances stability, allowing for precise and effective ball planting on BGA chips ranging from 9mm to 43mm. 2. Enhanced Functionality: The HT-90 features an adjustable chip size knob and diversion groove, facilitating easy and efficient pouring of
  • adjustable bga bga reball bga rework station reballing stencil jig holder1. Premium Material and Design: This BGA Reballing Station is constructed from aluminum alloy, making it both lightweight and durable. Its unique diagonal design enhances stability, allowing for precise and effective ball planting on BGA chips ranging from 9mm to 43mm. 2. Enhanced Functionality: The HT-90 features an adjustable chip size knob and diversion groove, facilitating easy and efficient pouring of
  • adjustable bga bga reball bga rework station reballing stencil jig holder1. Premium Material and Design: This BGA Reballing Station is constructed from aluminum alloy, making it both lightweight and durable. Its unique diagonal design enhances stability, allowing for precise and effective ball planting on BGA chips ranging from 9mm to 43mm. 2. Enhanced Functionality: The HT-90 features an adjustable chip size knob and diversion groove, facilitating easy and efficient pouring of

Description

Specifications: Item Type: BGA Reballing Station Product Model: HT-90 90x90 Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in Material: Aluminum alloy Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products. Voltage Parameter How to Use Package List 1 x BGA Reballing Station 1 x Hex Wrench

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