Type
CPU / Microprocessor
Market segment
Mobile
Family
T II Dual-Core Mobile
Model number ?
N530
CPU part number
TMN530DCR23GM is an OEM/tray microprocessor
Stepping codes
AAEGC AENAEKC AE
Frequency ?
2500 MHz
Bus speed ?
One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier ?
12.5
Package
638-pin lidless organic micro Pin Grid Array (UOL638)
A Package number
30600
Socket
Socket S1 (S1g4)
Size
1.38" x 1.38" / 3.5cm x 3.5cm
Weight
0.2oz / 5.6g (measured)
0.2oz / 6.5g (by specifications)
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Danube
Processor c ?
Champlain
c stepping ?
DA-C3
CPUID
100F63
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated, 128-bit wide
Level 1 cache size ?
2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size ?
2 x 1 MB 16-way set associative caches
Level 3 cache size
None
Cache latency [1]
3 (L1 cache)
15 (L2 cache)
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
Low power features
PowerNow!
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3L-1066
Maximum memory bandwidth (GB/s): 17.1
Other peripherals
HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power ?
35 Watt