General information
Type CPU / Microprocessor
Market segment Desktop
Family ph II X4
Model number ? 945
CPU part numbers HDX945WFK4DGM is an OEM/tray microprocessor
HDX945WFGMBOX is a boxed microprocessor with fan and heatsink
Stepping codes CACAC AC CACDC AC
Frequency ? 3000 MHz
Bus speed ? 667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier ? 15
Package 938-pin organic micro-PGA
Sockets Socket AM2+
Socket AM3
Architecture / Microarchitecture
Microarchitecture K10
Platform Dragon
Processor c ? Deneb
c stepping ? RB-C3
CPUID 100F43
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
758 million transistors
Die size 258mm2
Data width 64 bit
The number of CPU cores 4
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size ? 4 x 64 KB 2-way set associative instruction caches
4 x 64 KB 2-way set associative data caches
Level 2 cache size ? 4 x 512 KB 16-way set associative exclusive caches
Level 3 cache size Shared 6 MB 48-way set associative cache
Cache latency 3 (L1 cache)
Virtual memory 256 TB
Multiprocessing Uniprocessor
Features MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
Low power features Cool'n'Quiet 3.0
CoolCore Technology ?
Dual Dynamic Power Management ?
c C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 21.3
Other peripherals HyperTransport 3 technology
Electrical / Thermal parameters
V c ? 0.85V - 1.4V
Maximum operating temperature ? 55°C - 70°C
Thermal Design Power ? 95 Watt