c i3-8350K specifications
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
c i3
Model number ?
i3-8350K
CPU part numbers
CM8068403376809 is an OEM/tray microprocessor
BX80684I38350K is a boxed processor without fan and heatsink (English version)
BXC80684I38350K is a boxed processor without fan and heatsink (Chinese version)
Frequency?
4000 MHz
Low power frequency
800 MHz
Bus speed?
8 GT/s
Clock multiplier?
40
Package
1151-land Flip-Chip Land Grid Array
S-spec numbers
Part number
ES/QS processors
Production processors
QNES
SR3N4
BX80684I38350K
+
BXC80684I38350K
+
CM8068403376809
+
Unknown
+
Architecture / Microarchitecture
Microarchitecture
Coffee Lake
Processor c ?
Coffee Lake-S
c stepping ?
B0 (QNES, SR3N4)
Manufacturing process
0.014 micron
Data width
64 bit
The number of CPU cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size?
4 x 256 KB 4-way set associative caches
Level 3 cache size
8 MB 16-way set associative shared cache
Physical memory
64 GB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / I 64 ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
Security Features
NX / XD / Execute disable bit ?
MPX / Memory Protection Extensions
SGX / Software Guard Extensions
SMAP / Supervisor Mode Access Prevention
SMEP / Secure Mode Execution Protection
Low power features
c C1/C1E, C3, C6, C7, C8, C9 and C10 states
Package C2, C3, C6, C7, C8, C9 and C10 states
Enhanced / technology ?
Integrated peripherals / components
Display controller
3 displays
DVI / DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics
GPU Type: I UHD 630
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Execution units: 23
Base frequency (MHz): 350
Maximum frequency (MHz): 1150
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
ECC supported: Yes
Other peripherals
Direct Media Interface 3.0 (4 lanes)
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Minimum/Maximum operating temperature ?
0°C (case temperature) - 63.7°C (case temperature) [1]
100°C (Digital Thermal Sensor)
Thermal Design Power?
91 Watt