c i3-6300 specifications
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Model number?
i3-6300
CPU part numbers
CM8066201926905is an OEM/tray microprocessor
BX80662I36300is a boxed processor with fan and heatsink (English version)
BXC80662I36300is a boxed processor with fan and heatsink (Chinese version)
Frequency?
3800 MHz
Bus speed?
8 GT/s
Clock multiplier?
38
S-spec numbers
Part number
ES/QS processors
Production processors
QJZ9
SR2HA
BX80662I36300
+
BXC80662I36300
+
CM8066201926905
+
Unknown
+
Architecture / Microarchitecture
Microarchitecture
Skylake
Processor c?
Skylake-S
c stepping?
S0 (SR2HA)
Manufacturing process
0.014 micron
Data width
64 bit
The number of CPU cores
2
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size?
2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size?
2 x 256 KB 4-way set associative caches
Level 3 cache size
4 MB 16-way set associative shared cache
Physical memory
64 GB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / I 64?
NX / XD / Execute disable bit?
HT / Hyper-Threading technology?
VT-x / Virtualization technology?
VT-d / Virtualization for directed I/O
MPX / Memory Protection Extensions
SGX / Software Guard Extensions
SMAP / Supervisor Mode Access Prevention
SMEP / Secure Mode Execution Protection
Low power features
Enhanced / technology?
Integrated peripherals / components
Display controller
3 displays
Integrated graphics
GPU Type: HD 530
Graphics tier: GT2
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 1150
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals
Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Maximum operating temperature?
100°C
Thermal Design Power?
51 Watt