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Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone in Saudi Arabia

Restokki BGA Reballing Station Universal Stencil Solder Aluminum Alloy Rework Kit HT90 90x90 for Laptop CPU Mobile Phone

SAR 156
Brand
Restokki
Weight
372 g
– 1 +

Special Features

  • [HIGH-QUALITY ALUMINUM ALLOY STRUCTURE] This reballing station features a durable and lightweight aluminum alloy construction, ensuring longevity and reliability
  • [UNIVERSAL DIAGONAL BALL PLANTING FIXTURE] The BGA universal stencil holder has an aluminum alloy plating that is suitable for 9mm to 43mm BGA chip ball planting
  • [CHIP SIZE ADJUSTMENT] Adjust the chip size knob and diversion groove to easily pour out excess tin beads, making the rework process more efficient and precise
  • [VERSATILE APPLICATION] Ideal for laptop CPU and mobile phone digital products, this station facilitates BGA manual soldering for plant tin rework with ease and accuracy
  • [EASY TO USE] Simplify your reballing process with this user-friendly station, ideal for both professionals and DIY enthusiasts looking for reliable results

Description

Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List：
1 x BGA Reballing Station
1 x Hex Wrench

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