General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
P Dual-Core
Model number ?
G4560
CPU part numbers
CM8067702867064 is an OEM/tray microprocessor
BX80677G4560 is a boxed processor (English version)
BXC80677G4560 is a boxed processor (Chinese version)
Frequency ?
3500 MHz
Clock multiplier ?
35
Package
1151-land Flip-Chip Land Grid Array
Socket
Socket 1151 / H4 / LGA1151
Size
1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Part number
ES/QS processors
Architecture / Microarchitecture
Microarchitecture
Kaby Lake
Processor c ?
Kaby Lake-S
c stepping ?
B0 (SR32Y)
Manufacturing process
0.014 micron
Data width
64 bit
The number of CPU cores
2
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ?
2 x 256 KB 4-way set associative caches
Level 3 cache size
3 MB 12-way set associative shared cache
Physical memory
64 GB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TSX / Transactional Synchronization Extensions
MPX / Memory Protection Extensions
SGX / Software Guard Extensions
Low power features
c C1/C1E, C3, C6, C7 and C8 states
Package C2, C3, C6, C7 and C8 states
Enhanced / technology ?
Integrated peripherals / components
Display controller
3 displays
DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics
GPU Type: I HD 610
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
Direct Media Interface 3.0 (4 lanes)
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Maximum operating temperature ?
100°C
Thermal Design Power ?
54 Watt