Type
CPU / Microprocessor
Market segment
Desktop
Family
P Dual-Core
Model number ?
G2010
CPU part numbers
CM8063701444800 is an OEM/tray microprocessor
BX80637G2010 is a boxed processor with fan and heatsink (English version)
BXC80637G2010 is a boxed processor with fan and heatsink (Chinese version)
Frequency ?
2800 MHz
Low power frequency
1600 MHz
Clock multiplier ?
28
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 / H2 / LGA1155
Size
1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Part number
ES/QS processors
Architecture / Microarchitecture
Microarchitecture
Ivy Bridge
Processor c ?
Ivy Bridge
c stepping ?
P0 (SR10J)
Manufacturing process
0.022 micron
Data width
64 bit
The number of CPU cores
2
The number of threads
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ?
2 x 256 KB 8-way set associative caches
Level 3 cache size
3 MB 12-way set associative shared cache
Physical memory
32 GB
Multiprocessing
Not supported
Features
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
VT-x / Virtualization technology ?
Low power features
Enhanced / technology ?
Integrated peripherals / components
Integrated graphics
GPU Type: HD (Ivy Bridge)
Microarchitecture: Gen 7
Base frequency (MHz): 650
Maximum frequency (MHz): 1050
The number of supported displays: 3
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
Direct Media Interface 2.0
PCI Express 2.0 interface
Electrical / Thermal parameters
Maximum operating temperature ?
105°C (junction)
Thermal Design Power ?
55 Watt