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LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards in Saudi Arabia LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards in Saudi Arabia LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards in Saudi Arabia LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards in Saudi Arabia LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards in Saudi Arabia

LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards

SAR 40

Brand
YEGAFE
Category
Fans & Cooling
Weight
57 g
1 +

Special Features

  • COMPATIBILITY: Designed for LGA 1700 socket motherboards, including Z790, Z690, B760, B660, and H610 models supporting 12th, 13th, and 14th Gen processors
  • PERFORMANCE: Reduces CPU temperatures by correcting the socket bending issue common in LGA 1700 platforms
  • INSTALLATION: Simple mounting process requires basic tools and provides direct replacement for stock ILM (Independent Loading Mechanism)
  • CONSTRUCTION: Precision-engineered frame ensures even pressure distribution across the CPU surface for optimal thermal contact
  • DESIGN FEATURES: Maintains consistent contact between CPU and cooler, eliminating gaps that can impact heat transfer efficiency
  • In case the item is damaged/defective upon arrival (or: if it does not work properly upon arrival), please choose between a refund or exchange. We sincerely apologize for any inconvenience in advance

Description

Enhance your CPU's performance with this LGA 1700 Contact Frame and Anti-Bending Correction Kit, designed specifically for 12th, 13th, and 14th generation Intel processors. This essential upgrade helps maintain optimal contact between your CPU and cooler by preventing the common issue of substrate bending.
Achieve Better Thermal Performance
By ensuring even pressure distribution, this kit can lead to significantly lower temperatures and improved thermal performance for your CPU during intensive workloads and gaming sessions.
Wide Motherboard Compatibility
Compatible with a wide range of LGA 1700 motherboards including Z790, Z690, B760, B660, and H610 models. The straightforward installation process makes it easy to maximize your processor's cooling efficiency.
Superior Replacement Design
The contact frame serves as a direct replacement for the stock ILM (Integrated Loading Mechanism), ensuring consistent pressure distribution across the entire CPU surface for optimal thermal transfer.
Essential for Enthusiasts
Whether you're a performance enthusiast pushing your system to the limits or simply looking to maintain your system's longevity, this contact frame kit provides a practical solution to improve your CPU's thermal characteristics and stability.

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