Copper Stacked Fin with Vapor Chamber Base Heatsink
Supports up to TDP 205 Watts
Recommended for 1U Server and up
Description
Dynatron B4 heatsink supports Intel FCLGA 3647 Socket CPU with Narrow ILM. The copper stacked fins with vapor chamber base heatsink comes with pre-applied Shin-Etsu thermal grease. Recommended for 1U rackmount server solutions up to 205W TDP.