1. [PREMIUM MATERIAL] Made of high-quality 304 stainless steel, these stencils are durable and reliable for reballing BGA ICs.
2. [EASY TO USE] Can be heated with a hot air machine without deformation, making the reballing process quick and efficient.
3. [VARIOUS SIZES] Comes in 5 different sizes totaling 33pcs, ensuring compatibility with a wide range of BGA chips.
4. [MARKED SPECIFICATIONS] Each stencil is labeled for easy selection, making the reballing process hassle-free.
5. [WIDE APPLICATION] Specifically designed for laptops, desktops, communication mainboards, and graphics cards, suitable for various BGA chips.

Spec:
These stencils were made by high quality material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Features:
These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 5 different sizes and totally 33pcs, enough to meet your various needs.
The specifications are marked on the surface, convenient for you to choose.
It is specially designed for laptop, desktop, communication main board bridge, and graphics card, etc all kinds of BGA chips.
Specification:
Material: Stainless Steel
Color: Silver
Quantity: 33pcs
Weight: Approx. 61g / 2.2oz
Package List:
2pcs x BGA Stencils for 0.35mm Solder Ball
1pcs x BGA Stencils for 0.4mm Solder Ball
14pcs x BGA Stencils for 0.5mm Solder Ball
13pcs x BGA Stencils for 0.6mm Solder Ball
3pcs x BGA Stencils for 0.76mm Solder Ball

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