High thermal conductivity 11.25W/mK, suitable for overclocking and fast heat transport between cooler and chipsets
وصف
Evenly distributed thermal conductivity layers with a high thermal conductivity of 11.25W/mK ensure high efficiency heat transfer, allow higher clock speeds and keep your system in peak condition.
Precision applicator and angled spreader combination designed with ease of use in mind. FUZEIce™ can withstand up to 200 °C and lasts for years