Item Type: Heatsink
Product Model: HMT60
Product Material: Copper, silicone.
Copper Thermal Conductivity: 401W/mK
Product Specification: (Approx. )
10pcs 20 x 20 x 0.3mm / 0.79 x 0.79 x 0.01in Copper Pad
10pcs 20 x 20 x 0.5mm / 0.79 x 0.79 x 0.02in Copper Pad
10pcs 20 x 20 x 0.8mm / 0.79 x 0.79 x 0.03in Copper Pad
10pcs 20 x 20 x 1mm / 0.79 x 0.79 x 0.04in Copper Pad
10pcs 20 x 20 x 1.2mm / 0.79 x 0.79 x 0.05in Copper Pad
10pcs 20 x 20 x 1mm / 0.79 x 0.79 x 0.04in Silicone Pad
Function: Used for gap filling in PC component cooling.
Usage Scenario: For the development board and laptop GPU VGA VRAM RAM IC chip M.2 NVMe SSD, etc.
Package List:
50 x
Copper Pad10 x Silicone Pad
1 x Storage Box