High Thermal Conductivity Aluminum Nitride Silicone Sheet - 18.6W/m.k Heat Dissipation Pad - 1 Piece(0.3mmx50x100 mm)
Size0.3mmx50x100 mm
Special Features
- Exceptional thermal conductivity of 18.6W/m.k ensures efficient heat dissipation for electronics.
- Versatile application for graphics cards, PCBs, MOSFETs, and various electronic components to enhance cooling efficiency.
- Made from dimethylsilane and aluminum nitride for superior performance and durability.
- Ideal for use in LED, communication devices, photovoltaic systems, power supplies, and new energy vehicles.
- Available in multiple thickness options to suit your specific thermal management needs; choose wisely to prevent overheating.
Description
Tips: Please choose the most suitable thickness you need, otherwise it will cause the temperature to increase.
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