20mm Heatsink Kit 20x20mm + pre-applied Thermal Conductive Adhesive Tape, Cooler Heat Sink for Cooling BGA chipset, SOC GPU IC Chips VRAM VGA RAM (20mmx20mmx15mm).

20mm (L) x 20mm (W) x 15mm (H) extruded aluminum heat sink kit is made from 6063-T5 aluminum alloy with high thermal conductivity, structure stability and light weight. The heat sink extrusion is in vertical and horizontal grooves, that is greatly increases the heat dissipation function. The surface of extruded aluminum is anodized in black. This kit of heat sink comes with 20x20mm pre-applied thermal conductive adhesive tape, for easy installation and optimum heat conductivity.

10pcs anodized black 20×20 heatsink together with pre-applied thermal conductive adhesive tape is easy to install and efficient in heat conduction from power semiconductor sources BGA. This 20mm heatsink kit is suitable for a variety of cooling applications such as LED, FPV transmitter, Vram, RAM, IC Chips, etc.

Dimension: 0.79 x 0.79 x 0.63 inch / 20mm x 20mm x 15mm (L*W*H)

Material: Extruded Aluminum 6063-T5

Color: Black

Coating: Anodized

Weight: 0.18 oz / 5 gram per pc

Mounting Style: SMD/SMT

Fin Style: Vertical

Number of fins: 5×5

Pre applied thermal conductive adhesive tape

Model No: 202016B10-8810

Package Includes: 10 pieces 20mm heatsink