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20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia 20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade in Saudi Arabia

20Pcs Gold Plated 8-Pin DIP Round IC Chip Socket Adaptor 2.54mm Pitch Straight IC Socket for 8 DIP OP-AMP IC Sockets for NE5532 Burr Brown LM Audio Grade

SAR 59
Weight
20 g
– 1 +

Special Features

  • Package Content: 20pcs DIP IC Socket.
  • Pitch: 2.54mm/ 0.1''; Each Size(Approx): 10 x 10 x 7.5mm/ 0.39" x 0.39" x 0.3"(L*W*H).
  • Use: The IC socket is put into use on the front plate of the power amplifier, so that operational amplifiers with different timbres can be replaced easily.
  • Performance: Owing to the utilization of gold-plated IC socket, the contact resistance is extremely small, and the performance is notably superior to that of ordinary IC sockets.
  • Advantages: The IC socket makes it possible for the chip to be pulled and inserted directly without being soldered to the PCB board. It possesses heat resistance and good pin stability, and can withstand repeated assembly and disassembly without causing damage to the chip.

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