Easycargo 30gram Thermal Conductive Glue Kit, High Performance Silicone Thermal Plaster Adhesive Glue, Cooler Epoxy Compound for Heatsink GPU VRM VRAM LED IC Chips MOSFET BJT Transistor 3D Printer PCB

30 gram high performance thermal glue with strong adhesion.
Thermal conductivity > 0.975 w/mk
Thermal Impedance: < 0.06
Can be applied for cooling the interface of heatsink and LED, Mosfet transistor, IC Chips, etc

Properties

Color: white

Surface drying time: 2-8 min

Hardness (Shore A): 45-75

Tensile strength (MPa): 2.0

Elongation: 100%

Adhesion and tensile strength(MPa): 1.5-2.0

Thermal conductivity(W/m.k): > 0.975

Volume resistance(c-in/W):
Dielectric strength(KV/mm): 20

Dielectric constant: 3.0

Dielectric loss factor(60Hz): 0.003

Continuous use temp: 200℃

Content:

Silicone material: 30%

Thermal conductive material: 40%

Strengthen fillers: 20%

Crossing agent: 10%

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