HMAA2GS6CJR8N-XN

Features
Power Supply: VDD=1.2V (1.14V to 1.26V)
VDDQ = 1.2V (1.14V to 1.26V)
VPP - 2.5V (2.375V to 2.75V)
VDDSPD=2.25V to 3.6V
Functionality and operations comply with the DDR4 SDRAM datasheet
16 internal banks
Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Supports ECC error correction and detection
On-Die Termination (ODT)
Temperature sensor with integrated SPD for ECC SODIMM
This product is in compliance with the RoHS directive.
Per DRAM Addressability is supported
Internal Vref DQ level generation is available