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Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer in Saudi Arabia

Chrees Orange Pi 3B Case Aluminum Alloy Enclosure with Cooling Fan and Heat Dissipation Silicone Pads for Orange Pi 3B Single Board Computer

SAR 78

Brand
Chrees
Category
Computer cases
– 1 +

Special Features

  • Compatible Model: Specifically designed to fit for Orange Pi 3B, this aluminum alloy enclosure case features accurate hole placements that facilitate simple installation.
  • Aluminum Alloy Material: This development board enclosure case is crafted from premium aluminum alloy, effectively protecting your development board while also promoting efficient heat dissipation.
  • Multiple Grooves Design: The case features several grooves that allow hot air to escape easily, significantly improving the overall cooling performance and ensuring your components stay at optimal operating temperatures.
  • Thermal Conductive Silicone Pads: The aluminum case is equipped with thermal conductive silicone pads placed over the CPU and memory locations, enhancing heat transfer efficiency.
  • Passive Cooling Fan: The inclusion of a cooling fan ensures that your development board from outstanding passive heat dissipation, helping to maintain good performance during running.

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