【High Performance】: CPU chip heat insulation pad high temperature resistance, non slip, not easily deformed, thickness of about 4.8mm
【Directly Replace】: Directly replace the old or broken CPU chip heat insulation pad
【Material】: The phone repair pad is made of silicone material, is wear resistant and long service time
【Easy To Use】: The repair pad is easy to use and do not require complex steps to use
【Size】:The IC silicone repair pad size is 12.5 cm x 12.5 cm/4.92 inch x 4.92 inch
Description
Description:
- 【Material】: The phone repair pad is made of silicone material, is wear resistant and long service time
- 【Size】:The IC silicone repair pad size is 12.5 cm x 12.5 cm/4.92 inch x 4.92 inch
- 【Directly Replace】: Directly replace the old or broken CPU chip heat insulation pad
- 【Easy To Use】: The repair pad is easy to use and do not require complex steps to use
- 【High Performance】: CPU chip heat insulation pad high temperature resistance, non slip, not easily deformed, thickness of about 4.8mm
Specification:
- Material: Silicone
Size Chart:
12.5 cm x 12.5 cm/4.92 inch x 4.92 inch
Thickness: 0.48cm/0.19inch
Package Includes:
1x Phone Repair Pad
Note:
Please allow slightly errors 1-2cm/0.39-0.79inch differences due to manual measurement.