CPU Thermal Paste High-Performance Heatsink Compound 10g HY204 4.0W/mK for PC Cooling CPU VGA Chipset (-50°C~340°C)
Special Features
- High-Efficiency Thermal Transfer: Optimized 4.0W/mK conductivity rapidly dissipates CPU heat with minimal thermal resistance (<0.028°C-in²/W)
- Advanced Insulation: Non-conductive silicone formula protects PC components from corrosion, safe for CPU/VGA/chipsets
- Precision Engineering: Maintains stable viscosity (300±10 1/10mm) across extreme temperatures (-50°C~340°C)
- Multi-Device Compatibility: Ideal for desktop/laptop cooling, network equipment, automotive lighting systems, and power converters
- Convenient Jar Packaging: Secure container ensures clean storage and easy access for repeated CPU/heatsink applications
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