PROVEN HIGH PERFORMANCE--With 6.5 W/m·K thermal conductivity and an ultra-low thermal impedance of 0.009 K·in²/W, TP-1 rapidly transfers heat away from your processor, delivering measurable temperature reductions from the very first application.
NO BURN-IN REQUIRED — Achieves peak thermal performance immediately upon application — no waiting, no cycling needed. Your system runs at optimal temperatures right out of the tube.
LONG-LASTING STABILITY — Engineered with a proprietary low dry-out formula that resists hardening and pumping-out effects, ensuring consistent thermal performance for years of continuous use without degradation.
EASY, PRECISE APPLICATION — The smooth, spreadable consistency allows for effortless, even distribution across the heat spreader with just a spatula or spreader tool. A small amount goes a long way, making every gram count.
COMPLETELY SAFE & NON-CORROSIVE — The electrically non-conductive and non-corrosive formulation protects your components during application and throughout the life of your build. No risk of short circuits or material damage.
FLEXIBLE TEMPERATURE RANGE — Rated for operation from -40°C to 120°C, making TP-1 suitable for extreme overclocking, ambient environments, and everything in between.
FLEXIBLE TEMPERATURE RANGE — Rated for operation from -40°C to 120°C, making TP-1 suitable for extreme overclocking, ambient environments, and everything in between.
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