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100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia 100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm in Saudi Arabia

100 Pcs Pre-Cut Thermal Pads Insulated Thermal Silicone Pads Heat Dissipation Pad for PC Phone PCB Motherboard CPU BGA IC Chips Repair,12x12x1.5mm

SAR 53
Brand
DIYPHONE
Category
Fans & Cooling
– 1 +

Special Features

  • High thermal conductivity of 6.0W/MK, allowing the thermal paste to quickly fill the tiny gaps in electronic components, rapidly conducting and dissipating heat generated by high-power CPUs/GPUs.
  • High voltage and high temperature resistance, safe and stable.
  • Strong thermal conductivity and heat dissipation performance.
  • Strong insulation performance, providing comprehensive protection.
  • Provides excellent heat dissipation performance and worry-free insulation protection for electronic devices, suitable for various scenarios such as for iPhone and Android phones, high-power LED modules, and integrated chips.

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