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UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling in Saudi Arabia

UTP-8 Thermal Putty,Cooling Pad for GPU VGA IC Processor (10, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling

SAR 68
Brand
UPSIREN
Category
Fans & Cooling
Weight
11 g
– 1 +

Special Features

  • NOT SUITABLE FOR CPU: 14.8 W/mK high‑conductivity thermal putty, works as replacement for soft thermal pads, fills gaps for GPU, VGA and memory IC chips.
  • NON‑CONDUCTIVE & SAFE: Halogen‑free and RoHS compliant formula prevents short‑circuit risk, delivers stable performance under high‑temperature working conditions.
  • LOW VISCOSITY & MOLDABLE: Tacky flexible texture fits uneven surfaces. Supports auto‑dispensing equipment and stencil screen‑printing application scenarios.
  • NO DRY‑OUT PERFORMANCE: Fully cured thermal material will not dry out over time, great for electronic assembly, rework and field repair projects.
  • GAP‑FILLING COST‑SAVER: Compresses well to fill gaps compared with rigid thermal pads, practical for PC modders and electronics maintenance technicians.

Description

UTP‑8 Moldable Thermal Putty is RoHS compliant halogen‑free gap‑filling thermal material, NOT intended for CPU use. 14.8W/mK thermal performance replaces traditional thermal pads for GPU, VGA and memory IC chips. Low‑viscosity tacky texture supports manual or auto‑dispensing installation. It will not dry out, ideal for electronic assembly, rework and field repair.

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