✔ PROFESSIONAL ACID COPPER PLATING SOLUTION – High-performance electroplating bath designed for jewelry, metal parts, and restoration projects, delivering smooth, uniform copper deposition.
✔ IDEAL UNDERCOAT FOR MULTI-LAYER PLATING – Perfect for improving adhesion before nickel or other top coatings on steel, brass, bronze, tin, lead, and nickel alloys.
✔ FILLS POROSITY & IMPROVES SURFACE QUALITY – Effectively fills minor casting imperfections, creating a clean, even base for superior finishing results.
✔ CYANIDE-FREE FORMULATION – Contains no cyanide; intended for use in controlled electroplating environments following proper safety procedures.
✔ EASY ROOM-TEMPERATURE OPERATION – Works efficiently at 3–9 volts in a room-temperature bath; agitation recommended for optimal, consistent plating results.
✔ READY-TO-USE & MADE IN USA – Convenient 1 Quart (0.94 L) solution, formulated for immediate use with pure or phosphorized copper anodes for reliable performance.