Feature:
For Phone Motherboard Disassemble Blade Set, Phone PCB BGA Chip
Crooked Knife Disassembly Cleaning Pry tool for mobile phone motherboard sealant glue, UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue
Solder Paste Scraping pen for cell Phone BGA Repair and UV Glue Cleaning Tool.
Scimitar moon phone CPU NAND Baseband Edge glue Removing Cleaning Tool, Mobile phone motherboard CPU NAND Baseband chip edge glue removing pen.
​What's included: 1 Set IC Remover Blades Kit.

Specification:
Handle Material: Titanium Alloy
Blade Material: Steel
007: 1pcs handle + 3pcs moon head

​What's included:
1 Set IC Remover Blades Kit