Sn99/Ag0.3/Cu0.7, Lead Free Solder Paste No Clean, 217℃ Melting Point (5ML)
Special Features
- Composition of Solder Paste: Sn: 99% / Ag: 0.3% / Cu: 0.7% / Flux11.2%.
- High-Temperature Soldering Paste, Melting Point: 217°C (423°F).
- Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe).
- Syringe Solder Paste Flux Properties: Lead-Free / Smooth & Even Solder Joints / No Solder Balls or Bridging After Reflow.
- Solder Pasteing Applications: Welding of Heat Sink Modules & LED Soldering & High-Frequency Soldering & PCB BGA CPU SMD SMT Electronic Device Rework Tools.
- Warranty: If You Have Any Questions, Please Feel Free to Contact Us at Any Time. Thank You.
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