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Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material in Saudi Arabia

Vikye Compact BGA Reballing Stencil Precise Positioning Tin Planting Template for Phone Repair, Stainless Steel Material

SAR 45
– 1 +

Special Features

  • [VARIED PITCHES] The universal BGA reballing stencil comes with four different pitches, catering to various needs and ensuring versatility in your repairs.
  • [STURDY CONSTRUCTION] Made of premium stainless steel, the tin mesh solder template is robust and long-lasting, ideal for frequent use in repairs.
  • [ON-THE-GO REPAIRS] Easily carry the compact BGA reballing stencil for convenient repairs wherever you go.
  • [ENHANCED STABILITY] The precise positioning of the tin mesh solder template ensures stable soldering even at high temperatures.
  • [EFFORTLESS USAGE] Simply use the BGA reballing stencil directly for a hassle- and efficient repair process.

Description

1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.

Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

How to Use:
Use directly

packing list:
1 xBGA Reballing Stencil

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