High Thermal Conductivity, Low Thermal Expansion, High Hardness, Wear-Resistant, Stable at 1600°C,
For Semiconductor Equipment Insulating Supports.
Specification: Diameter x Length.
Description
High Thermal Conductivity, Low Thermal Expansion, High Hardness, Wear-Resistant, Stable at 1600°C,
For Semiconductor Equipment Insulating Supports.
Specification: Diameter x Length.